High-Frequency Jet Impingement Liquid Cooling Plate

I. Core Principle (Essential Difference from Traditional Flow Channels)

• Coolant passes through a dense array of micro-nozzles (diameter 0.1–1 mm)
• Impinges vertically at high speed onto the inner wall of the cold plate (heating surface)
• Instantly breaks the thermal boundary layer, increasing local heat transfer coefficient by 5–10 times
• Fluid diffuses rapidly and drains laterally, achieving extremely uniform temperature across the whole area (temperature difference < ±1℃)

II. Typical Structure

• Upper Chamber (Distribution Chamber): stabilizes pressure and distributes coolant evenly to nozzles
• Nozzle Plate: core component with hundreds to thousands of precision micro-holes (high-frequency jet array)
• Impingement Chamber (Heat Exchange Zone): jet impingement and intensive convective heat transfer
• Liquid Collection Chamber / Drainage Channel: quickly discharges the heat-absorbed coolant

III. Key Technical Features

• Extremely High Heat Dissipation Capacity

   

  Heat flux density: 200–1000 W/cm² (ordinary brazed plate approx. 50 W/cm²)

   

  Thermal resistance as low as 0.01–0.03 ℃/W
   
• Excellent Temperature Uniformity

   

  Full-surface temperature difference: ±0.5–±1℃

   

  Completely eliminates local hotspots
   
• Fast Response Speed

   

  Low thermal inertia, precise temperature control, suitable for transient high-power and pulse heating scenarios
   
• Relatively High Pressure Drop

   

  Requires matching high-pressure pump / high-flow cooling system
   
• High Manufacturing Precision Requirements

   

  Nozzle hole diameter, depth, and position tolerance: ±0.02–±0.05 mm
   

IV. Main Manufacturing Processes

• Precision Drilling + Vacuum Brazing

   

  Suitable for circular hole arrays with stable mass production

   

  Common materials: aluminum alloy / copper alloy, brazed sealing
   
• Photolithography / Etching + Diffusion Bonding

   

  Suitable for special-shaped nozzles and micro-scale slot jets

   

  Finer flow channels and lower thermal resistance (for AI/GPU/laser applications)
   
• 3D Printing (SLM)

   

  Integrated forming with complex topological channels + nozzles

   

  Lightweight design, suitable for customized aerospace components
   

V. Application Scenarios (Extreme Thermal Management)

• AI / Supercomputing Chips: H100/H200, GPU clusters, TPUs (>500W chips)
• SiC / GaN Power Modules: 800V electric drives, ultra-fast charging stations
• High-Power Lasers: fiber / semiconductor / UV lasers (heat flux > 300W/cm²)
• Radar / Phased Array: military T/R components, 5G/6G base stations
• Medical Imaging: MRI gradient amplifiers, CT detectors (temperature control accuracy ±0.5℃)
• Aerospace: satellite payloads, missile guidance (vibration-resistant, lightweight, high heat flux)

VI. Comparison with Conventional Liquid Cooling Plates

VII. Summary